Laser PCB Depaneler with ±20 μm Precision for FR4 PCB Boards
Laser PCB Separator Advantages
Laser PCB Separator Machine Principle
Laser PCB Separator Parameter
Parameter | ||
Technical parameters |
Main body of laser | 1480mm*1360mm*1412 mm |
Weight of machine | 1500Kg | |
Power | AC220 V | |
Laser | 355 nm | |
Laser |
Optowave 10W(US) |
|
Material | ≤1.2 mm | |
Precisio | ±20 μm | |
Platfor | ±2 μm | |
Platform | ±2 μm | |
Working area | 450*430 mm | |
Maximum | 3 KW | |
Vibrating | CTI(US) | |
Power | AC220 V | |
Diameter | 20±5 μm | |
Ambient | 20±2 ℃ | |
Ambient | <60 % | |
The Machine | Marble |
Laser PCB Separator Features
1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time
3. High quality ,no distortion,surface clean& uniformity;
4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed
Contact: Hou
Phone: +86 13510221120
Tel: 86-0769-82784046
Company: Shenzhen SMTfly Electronic Equipment Manufactory Ltd.
Add: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103